Welcome to Junwei Huang’s Homepage

Hello! My name is Junwei Huang — a Postdoctoral Fellow at the Institute of Microelectronics, University of Macau, advised by Prof. Rui P. Martins, collaborating with Prof. Yan Lu (Tsinghua University). I’m currently a Visiting Postdoctoral Researcher in the Department of Electrical Engineering and Computer Sciences at the University of California, Berkeley, advised by Professor Robert Pilawa-Podgurski.

My research interests focus on integrated voltage regulators (IVRs) and power management ICs (PMICs) — particularly hybrid switched-capacitor/inductor DC-DC converters, high-conversion-ratio power delivery, fast transient response, vertical/chiplet power delivery, and scalable multi-module power systems.

You can find my CV here.


Research Highlights


Education


Academic Appointments

  • Visiting Postdoctoral Researcher, Pilawa Power Electronics Research Group, EECS, University of California, Berkeley · 2025.09–present
    Faculty Host: Prof. Robert Pilawa-Podgurski

  • Postdoctoral Fellow, Institute of Microelectronics (IME) & State Key Laboratory of Analog and Mixed-Signal VLSI, University of Macau · 2025.09–present
    PIs: Prof. Rui P. Martins and Prof. Sai-Weng Sin

  • Research Assistant, Institute of Microelectronics (IME), University of Macau · 2024.10–2025.09
    PI: Prof. Rui P. Martins

  • Visiting Scholar, Department of Electronic Engineering, Tsinghua University · 2024.11–2025.05
    Faculty Host: Prof. Yan Lu


Research Summary

University of California, Berkeley, EECS · 2025.09–present

Research focuses on the co-design of board-level power electronics and on-interposer high-voltage integrated voltage regulators (HV-IVR, >6 V input) for next-generation GPU/CPU power delivery, leveraging hybrid switched-capacitor/inductor converter topologies and scalable distributed converter arrays to achieve high aggregate current, high current density, and high power density.

University of Macau, State Key Lab of Analog and Mixed-Signal VLSI · 2018.08–2025.09

  • Designed and taped out multiple hybrid SC/inductor DC-DC converters in 65 nm CMOS and 180 nm BCD processes, covering the full IC design cycle from topology innovation, circuit/layout implementation, to silicon measurement.
  • Demonstrated state-of-the-art efficiency (96.1% at 4-to-1.2 V), current density (1.46 A/mm² at 12:1), and transient response (63 mV droop @ 3.5 A load step) across hybrid converters with conversion ratios from 4:1 to 12:1.
  • Pioneered a scalable multi-module parallel architecture with one-pin decentralized current balancing, reducing interconnect complexity from O(N) to O(1) — directly applicable to IVR arrays and vertical power delivery.
  • 25 publications: 1 ISSCC highlight paper (1st author), 3 CICC 1st-author, 2 JSSC 1st-author, 1 TCAS-I 1st-author. Total: 6 ISSCC + 6 JSSC contributions.

Technical Skills

  • IC Design: Full-custom analog/mixed-signal IC design (schematic, layout, DRC/LVS, post-layout simulation, tape-out, lab measurement); switched-capacitor and hybrid DC-DC converter topologies; multi-loop control design; power stage optimization
  • Process Technologies: 65 nm CMOS, 180 nm BCD (high-voltage NMOS/PMOS)
  • EDA Tools: Cadence Virtuoso (Spectre, Layout XL), Ansys (HFSS/Maxwell), MATLAB/Simulink, Altium Designer (PCB)
  • Lab Equipment: Oscilloscopes, spectrum analyzers, semiconductor parameter analyzers, probe stations; board-level power converter testing; multi-chip measurement and characterization
  • Programming: SKILL (Cadence), Python, MATLAB, Verilog (digital control blocks)

Awards & Service

  1. Akrostar Technology Academic Prize for the academic year 2023/2024 (Top 3)
  2. Reviewer for IEEE TIE, IEEE OJIE, IEEE TCAS-I, IEEE TCAS-II, IEEE OJCAS
  3. Invited presenter at IEEE PES/PELS event at UC Berkeley